PTD Module & Integration
Device Yield Engineer - 732752
Description
PTD Module Engineers are
responsible for leading scientific research and enabling manufacture of
innovative device architectures coupled with the realization of these
architectures. Responsibilities include designing, executing and analyzing
experiments necessary to meet engineering specifications for their process. A
Module Engineer participates in the development of intellectual property and
the development of the equipment necessary to exploit understanding gained in
research (in collaboration with equipment suppliers.) The Engineer must work
effectively with the equipment supplier to identify shortcomings, propose and
evaluate hardware modification to mitigate issues and operate the manufacturing
line in order to integrate the many individual steps necessary for the
manufacture of complex microprocessors. Module Engineers are also responsible
for overseeing in-situ ramp to manufacturing volumes to demonstrate that the
technology meets requirements while simultaneously transferring the technology
to counterparts in manufacturing via 'Copy Exactly!' methodology. Module
ownership includes the install and qualification of manufacturing capacity at
the development site and audit installation/qualification and supervision of
first full loop at the production site. Must hold a PhD.
Qualifications
You must possess a
minimum of a Ph.D. degree majoring in Physics, Material Science, Chemical
Engineering, Electrical Engineering, Mechanical Engineering, or Chemistry.
PhD candidates should meet the additional following criteria:
- Demonstrated experience in keen experimental insight and ability to devise and focus on key experiments
PhD candidates should meet the additional following criteria:
- Demonstrated experience in keen experimental insight and ability to devise and focus on key experiments
- Excellent written and
verbal communication skills
- Highly motivated and
excited by self-directed hands-on work
- Creative and flexible
to thrive under changing priorities
- Teamwork skills
- Familiarity or
expertise with semiconductor processing is a plus but not necessary
- Minimum GPA = 3.5/4.0
for undergraduate and graduate education
Job Category
Engineering
Primary Location
USA-Oregon,
Hillsboro
Full/Part Time
Full
Time
Posting Date
Dec 5, 2014
Apply Before
Dec 5, 2015
Business Group
As
the world's largest chip manufacturer, Intel strives to make every facet of
semiconductor manufacturing state-of-the-art -- from semiconductor process
development and manufacturing, through yield improvement to final test and
optimization, and lastly packaging. Employees in the Technology and
Manufacturing group are part of a worldwide network of manufacturing and
assembly/test facilities.
Posting
Statement
Intel
prohibits discrimination based on race, color, religion, gender, national
origin, age, disability, veteran status, marital status, pregnancy, gender
expression or identity, sexual orientation or any other legally protected
status.
