Job Posting: Intel Corporation

PTD Module & Integration Device Yield Engineer - 732752 

Description

PTD Module Engineers are responsible for leading scientific research and enabling manufacture of innovative device architectures coupled with the realization of these architectures. Responsibilities include designing, executing and analyzing experiments necessary to meet engineering specifications for their process. A Module Engineer participates in the development of intellectual property and the development of the equipment necessary to exploit understanding gained in research (in collaboration with equipment suppliers.) The Engineer must work effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues and operate the manufacturing line in order to integrate the many individual steps necessary for the manufacture of complex microprocessors. Module Engineers are also responsible for overseeing in-situ ramp to manufacturing volumes to demonstrate that the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via 'Copy Exactly!' methodology. Module ownership includes the install and qualification of manufacturing capacity at the development site and audit installation/qualification and supervision of first full loop at the production site. Must hold a PhD. 

Qualifications

You must possess a minimum of a Ph.D. degree majoring in Physics, Material Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or Chemistry.

PhD candidates should meet the additional following criteria:

- Demonstrated experience in keen experimental insight and ability to devise and focus on key experiments

- Excellent written and verbal communication skills

- Highly motivated and excited by self-directed hands-on work

- Creative and flexible to thrive under changing priorities

- Teamwork skills

- Familiarity or expertise with semiconductor processing is a plus but not necessary

- Minimum GPA = 3.5/4.0 for undergraduate and graduate education

Job Category

Engineering 

Primary Location

USA-Oregon, Hillsboro 

Full/Part Time

Full Time

Posting Date

Dec 5, 2014 

Apply Before

Dec 5, 2015 

Business Group

 As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities. 

Posting Statement

Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.